{"id":30144,"date":"2023-11-05T15:27:08","date_gmt":"2023-11-05T14:27:08","guid":{"rendered":"https:\/\/osypka.de\/?p=30144"},"modified":"2024-01-23T11:27:47","modified_gmt":"2024-01-23T10:27:47","slug":"neue-aufbau-und-verbindungstechnik-fuer-zuverlaessige-biegbare-elektronik","status":"publish","type":"post","link":"http:\/\/osypka.de\/en\/neue-aufbau-und-verbindungstechnik-fuer-zuverlaessige-biegbare-elektronik\/","title":{"rendered":"New assembly and connection technology for reliable, bendable electronics"},"content":{"rendered":"

Neue Aufbau- und Verbindungstechnik f\u00fcr zuverl\u00e4ssige, biegbare Elektronik<\/h2>\n

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Projektlaufzeit: 01<\/span>.<\/span>0<\/span>4<\/span>.<\/span>20<\/span>22<\/span> bis <\/span>31<\/span>.<\/span>0<\/span>3<\/span>.<\/span>202<\/span>5<\/span><\/span>\u00a0<\/span><\/span><\/p>\n

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Projektbeschreibung<\/span><\/b>\u00a0<\/span><\/p>\n

Im Projekt <\/span>HyPerStripes<\/span> werden neue <\/span>Technologien f\u00fcr <\/span>die kosteng\u00fcnstige Herstellung und <\/span>A<\/span>ssemblierung von <\/span>lange<\/span>n<\/span>,<\/span> intelligente<\/span>n<\/span> und flexible<\/span>n<\/span> PCBs <\/span>entwickelt<\/span>, <\/span>die herk\u00f6mmliche <\/span>elektrische Leitungen<\/span> und Verbindungstechnologien <\/span>ersetzen <\/span>sollen<\/span>. <\/span>Dazu werden bei einigen Projektpartnern Roll-<\/span>to<\/span>-Roll Prozesse f\u00fcr <\/span>flexible und dehnbare PCBs <\/span>entwickelt<\/span>, wodurch die aktuell existierende Dimensionslimitierung gr\u00f6\u00dftenteils<\/span> entf\u00e4llt<\/span>. <\/span>Ein besonderer Bedarf <\/span>f\u00fcr de<\/span>rartige <\/span>PCBs <\/span>besteht im<\/span> medizinischen <\/span>Bereich<\/span>, d<\/span>a<\/span> deren Einsatz <\/span>zur Miniaturisierung und damit auch zum Einsatz von <\/span>mehr <\/span>Sensoren <\/span>und <\/span>anderen elektrischen Komponenten f\u00fchrt, was <\/span>Diagnostik<\/span>en<\/span> und <\/span>Therapien <\/span>deutlich verbessern kann<\/span>. <\/span>G\u00e4ngige Medizinprodukte verwenden<\/span> aktuell haupts\u00e4chlich Dr\u00e4hte oder Litzen, <\/span>welche sehr aufwendig <\/span>manuell <\/span>verbaut werden<\/span>, wodurch<\/span> bis zu 80 % der gesamten Produktkosten <\/span>entstehen<\/span> und zudem viel Platz <\/span>in <\/span>Anspruch <\/span>genommen wird<\/span>.<\/span> Im Projekt <\/span>entwickelt OSYPKA <\/span>ein <\/span>Neuroimplantat, <\/span>dessen Extremit\u00e4ten mit langen flexiblen und dehnbaren PCBs verbunden werden. D<\/span>as distale Ende des Implantats<\/span>, welches eine Vielzahl von Elektroden au<\/span>fweist<\/span>, ist zus\u00e4tzlich <\/span>mit <\/span>eine<\/span>r<\/span> A<\/span>n<\/span>wendungsspezifische<\/span>n<\/span> I<\/span>ntegrierte<\/span>n<\/span> Schaltung <\/span>(ASIC) ausgestattet<\/span>, mit deren Hilfe <\/span>die Messsignale digitalisiert <\/span>werden. D<\/span>ie Anbindung des ASICs erfolgt \u00fcber eine neuartige, biokompatible Verbindungstechnologie <\/span>(Nano <\/span>Wiring<\/span>), welche von einem Projektpartner entwickelt<\/span>,<\/span> und <\/span>im Projekt verifiziert w<\/span>erden soll<\/span>.\u00a0<\/span><\/span>\u00a0<\/span><\/p>\n

Demonstrator<\/span><\/b>\u00a0<\/span><\/p>\n

Im <\/span>Bild <\/span>ist <\/span>ein <\/span>Entwurf des Implantat<\/span>–<\/span>Demonstrators <\/span>dargestell<\/span>t. Der Demonstrator <\/span>kann grob in drei Bereiche aufgeteilt werden. <\/span>D<\/span>em Elektroden<\/span>–<\/span>Patch<\/span> mit integriertem ASIC<\/span>,<\/span> welches zur Messung und Stimulation <\/span>von neuronalen Systemen verwendet werden soll, de<\/span>s<\/span> flexiblen und dehnbaren PCB<\/span>s<\/span> (oder auch dem <\/span>HyPerStripe<\/span>), welche<\/span>s<\/span> die elektrischen Signale zum <\/span>proximalen Anschluss weiterleitet<\/span> und d<\/span>as <\/span>Anschlussst\u00fcck<\/span>, <\/span>welche<\/span>s<\/span> die Verbindung zum <\/span>implantierbaren Impulse Generator <\/span>(IPG) realisiert<\/span>.<\/span><\/span>\u00a0<\/span><\/p>\n

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 <\/p>\n","protected":false},"excerpt":{"rendered":"

Neue Aufbau- und Verbindungstechnik f\u00fcr zuverl\u00e4ssige, biegbare Elektronik     Projektlaufzeit: 01.04.2022 bis 31.03.2025\u00a0   Projektbeschreibung\u00a0 Im Projekt HyPerStripes werden neue Technologien f\u00fcr die kosteng\u00fcnstige Herstellung und Assemblierung von langen, intelligenten und flexiblen PCBs entwickelt, die herk\u00f6mmliche elektrische Leitungen und Verbindungstechnologien ersetzen sollen. Dazu werden bei einigen Projektpartnern Roll-to-Roll Prozesse f\u00fcr flexible und dehnbare PCBs […]<\/p>\n","protected":false},"author":1,"featured_media":30850,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"site-sidebar-layout":"default","site-content-layout":"default","ast-site-content-layout":"default","site-content-style":"default","site-sidebar-style":"default","ast-global-header-display":"","ast-banner-title-visibility":"","ast-main-header-display":"","ast-hfb-above-header-display":"","ast-hfb-below-header-display":"","ast-hfb-mobile-header-display":"","site-post-title":"","ast-breadcrumbs-content":"","ast-featured-img":"","footer-sml-layout":"","ast-disable-related-posts":"","theme-transparent-header-meta":"default","adv-header-id-meta":"","stick-header-meta":"","header-above-stick-meta":"","header-main-stick-meta":"","header-below-stick-meta":"","astra-migrate-meta-layouts":"default","ast-page-background-enabled":"default","ast-page-background-meta":{"desktop":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"tablet":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"mobile":{"background-color":"","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""}},"ast-content-background-meta":{"desktop":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"tablet":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""},"mobile":{"background-color":"var(--ast-global-color-5)","background-image":"","background-repeat":"repeat","background-position":"center center","background-size":"auto","background-attachment":"scroll","background-type":"","background-media":"","overlay-type":"","overlay-color":"","overlay-opacity":"","overlay-gradient":""}},"footnotes":""},"categories":[42],"tags":[],"class_list":["post-30144","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-forschungsprojekte"],"acf":[],"yoast_head":"\nNeue Aufbau- und Verbindungstechnik f\u00fcr zuverl\u00e4ssige, biegbare Elektronik - OSYPKA<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/2023.osypka.de\/neue-aufbau-und-verbindungstechnik-fuer-zuverlaessige-biegbare-elektronik\/\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Neue Aufbau- und Verbindungstechnik f\u00fcr zuverl\u00e4ssige, biegbare Elektronik - OSYPKA\" \/>\n<meta property=\"og:description\" content=\"Neue Aufbau- und Verbindungstechnik f\u00fcr zuverl\u00e4ssige, biegbare Elektronik     Projektlaufzeit: 01.04.2022 bis 31.03.2025\u00a0   Projektbeschreibung\u00a0 Im Projekt HyPerStripes werden neue Technologien f\u00fcr die kosteng\u00fcnstige Herstellung und Assemblierung von langen, intelligenten und flexiblen PCBs entwickelt, die herk\u00f6mmliche elektrische Leitungen und Verbindungstechnologien ersetzen sollen. 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