Development and testing of encapsulation technologies for innovative miniaturized active implants 

Project duration: October 1st, 2020 to September 30th, 2023

Project description 

The project aims to develop the next generation of miniaturized Active Implantable Medical Devices (AIMD), which are based on advanced flexible encapsulation technologies instead of conventionally used rigid encapsulations. The encapsulation performance of the technologies examined will be examined step by step using demonstrators. After an initial evaluation of the encapsulation system with helium bombing tests, additional aging tests are carried out in NaCl solution with temperature exposure. OSYPKA is developing, manufacturing and evaluating two encapsulation technologies in the project. On the one hand, a demonstrator for monitoring neuronal signals is being developed, which is encapsulated with flexible metal foils. On the other hand, flexible circuit boards with electronic components are being developed, which are encapsulated with a layer system developed by a project partner.

Demonstrator 

The picture shows the miniaturized circuit of the neuro-recorder without encapsulation. The attached coin is intended to serve as a size reference.